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rev. 1.5 july 2011 www.aosmd.com page 1 of 12 AOZ1342 dual channel usb switch general description the AOZ1342 power-distribution switches is intended for applications where heavy capacitive loads and short-circuits are likely to be encountered. this device incorporates n-channel mosfet power switches for power-distribution systems th at require multiple power switches in a single package. each switch is controlled by a logic enable input. gate drive is provided by an internal charge pump designed to control the power-switch rise times and fall times to minimize current surges during switching. the charge pump requires no external components and allows operation from supplies as low as 2.7 v. the AOZ1342 offers 1.5 a of maximum continuous current. the AOZ1342 is available in an exposed pad so-8 package and is rated over a -40 c to +85 c ambient temperature range. features z typical 70 m (nfet) z 1.5 a maximum continuous current z two enable options: en or en z vin range: 2.7 v to 5.5 v z open drain fault flag z fault flag deglitched (blanking time) z thermal shutdown z reverse current blocking z exposed pad so-8 package applications z notebook computers z desktop computers typical application AOZ1342 in oc1 en2/en2 oc2 en1/en1 out1 out2 gnd v in cx 0.1 f cx 22 f cx 0.1 f vout vout cx rx rx cx 22 f load load
AOZ1342 rev. 1.5 july 2011 www.aosmd.com page 2 of 12 ordering information *contact factory for availability aos green products use reduced levels of halogens, and are also rohs compliant. please visit www.aosmd.com/web/quality/rohs_compliant.jsp for additional information. pin configuration pin description part number maximum continuous current typical short-circuit current limit enable setting package output discharge environmental channel 1 channel 2 channel 1 channel 2 aoz1341ai 1 a 1a 1.5 a 1.5 a active low so-8 no green product rohs compliant aoz1341ei epad msop-8 aoz1341ai-1 active high so-8 aoz1341ei-1 epad msop-8 AOZ1342pi 1.5 a 1.5a 2 a 2 a active low epad so-8 AOZ1342pi-1 active high epad so-8 aoz1343ai* 1.5 a 0.5a 2 a 0.75 a active low so-8 aoz1343ei* epad msop-8 aoz1343ai-1* active high so-8 aoz1343ei-1* epad msop-8 aoz1312ai-1 1.5 a none 2 a none active high so-8 aoz1312ei-1 epad msop-8 aoz1310ci-1 0.5 a none 0.75 a none active high sot23-5 pin name pin number pin function gnd 1 ground in 2 input voltage en1/en1 3 enable input, logic high/logic low turns on power switch in-out1 en2/en2 4 enable input, logic high/logic low turns on power switch in-out2 oc2 5 overcurrent, open-drain outpu t, active low, in-out1 out2 6 power-switch output, in-out1 out1 7 power-switch output, in-out2 oc1 8 overcurrent, open-drain outpu t, active low, in-out2 oc1 out1 out2 oc2 1 2 3 4 gnd in en1/en1 en2/en2 exposed pad so-8 (top view) 8 7 6 5 pad
AOZ1342 rev. 1.5 july 2011 www.aosmd.com page 3 of 12 absolute maximum ratings exceeding the absolute maximum ratings may damage the device. note: 1. devices are inherently esd s ensitive, handling precautions are required. human body model is a 100 pf capacitor discharging through a 1.5 k resistor. recommended operating conditions the device is not guaranteed to operate beyond the recommended operating conditions. parameter rating input voltage (v in )6 v enable voltage (v en )6 v storage temperature (t s ) -55 c to +150 c maximum continuous current 1.5 a esd rating (1) 2 kv parameter rating input voltage (v in ) +2.7 v to +5.5 v junction temperature (t j ) -40 c to +125 c package thermal resistance exposed pad so-8 ( ja ) 45 c/w electrical characteristics t a = 25 c, v in = v en = 5.5 v, unless ot herwise specified. symbol parameter conditions min. typ. max. units power switch r ds(on) switch on-resistance v in = 2.7 v to 5 v, i o = 0.5 a/1.5 a 70 135 m t r rise time, output v in = 5.5 v c l = 1 f, r l = 5 0.6 1.5 ms v in = 2.7 v 0.4 1 t f fall time, output v in = 5.5 v 0.05 0.5 ms v in = 2.7 v 0.05 0.5 fet leakage current out connect to ground, 2.7 v v in 5.5 v, v (enx ) = v in or v (enx) = 0 v -40 c t j 125 c (2) 1 a enable input en or en v ih high-level input voltage 2.7 v v in 5.5 v 2.0 v v il low-level input voltage 2.7 v v in 5.5 v 0.8 v i i input current -0.5 0.5 a t on turn-on time c l = 100 f, r l = 5 3ms t off turn-off time c l = 100 f, r l = 5 10 current limit i os short-circuit output current (per channel) v (in) = 2.7 v to 5.5 v, out connected to gnd, device enable into short-circuit, channel 1 or 2 1.6 2.0 2.4 a i oc_trip overcurrent trip threshold (per channel) v (in) = 5 v, current ramp ( 100 a/s) on out, channel 1 or 2 1.6 2.2 2.5 a supply current supply current, low-level output no load on out, 2.7 v v in 5.5 v, v (enx ) = v in or v (enx) = 0 v t j = 25c 0.5 1 a -40 c t j 125 c (2) 0.5 5 supply current, high-level output no load on out, v (enx ) = 0 v or v (enx) = 5.5 v t j = 25 c 65 81 a -40 c t j 125 c (2) 65 90 reverse leakage current v (outx) = 5.5 v, in = ground 0.2 a
AOZ1342 rev. 1.5 july 2011 www.aosmd.com page 4 of 12 note: 2. parameters are guaranteed by design only and not production tested. undervoltage lockout low-level voltage, in 2.0 2.5 v hysteresis, in 200 mv overcurrent oc1 and oc2 output low voltage v ol(ocx) i o(ocx) = 5 ma 0.4 v off-state current v o(ocx) = 5 v or 3.3 v 1 a oc_l deglitch ocx assertion or deassertion 4 8 15 ms thermal shutdown thermal shutdown threshold 135 c recovery from thermal shutdown 105 c hysteresis 30 c electrical characteristics (continued) t a = 25 c, v in = v en = 5.5 v, unless ot herwise specified. symbol parameter conditions min. typ. max. units
AOZ1342 rev. 1.5 july 2011 www.aosmd.com page 5 of 12 functional block diagram deglitch deglitch oc1 en1/en1 in en2/en2 oc2 out1 out2 thermal shutdown thermal shutdown current limit gate driver enable 1 enable 2 2.2 v gate driver AOZ1342 current limit uvlo comparator
AOZ1342 rev. 1.5 july 2011 www.aosmd.com page 6 of 12 functional characteristics figure 1. turn-on delay and rise time with 1 f load (active high) figure 2. turn-off delay and fall time with 1 f load (active high) figure 3. turn-on delay and rise time with 100 f load (active high) figure 4. turn-off delay and fall time with 100 f load (active high) figure 5. short-circuit current, device enable to short (active high) figure 6. 0.6 load connected to enable to device (active high) en 5v/div vout 2v/div en 5v/div vout 2v/div en 2v/div iout 1a/div oc 2v/div iout 1a/div en 5v/div vout 2v/div en 5v/div vout 2v/div 400 s/div 400 s/div 400 s/div 400 s/div 400 s/div 2ms/div r l = 5 c l = 1 f t a = 25c r l = 5 c l = 1 f t a = 25c r l = 5 c l = 100 f t a = 25c r l = 5 c l = 100 f t a = 25c
AOZ1342 rev. 1.5 july 2011 www.aosmd.com page 7 of 12 typical characteristics figure 7. supply current, output enabled vs. junction temperature 70 60 50 40 30 20 10 0 junction temperature ( c) supply current ( a) vin=2.5v vin=3.3v vin=5v vin=5.5v figure 8. supply current, output disabled vs. junction temperature 0 0.05 0.1 0.15 0.2 0.25 0.3 0.35 0.4 0.45 0.5 junction temperature (c) supply current ( a) figure 9. rds(on) vs. ambient temperature 160 140 120 100 80 60 40 20 0 ambient temperature (c) vin=2.5v vin=3.3v vin=5v vin=5.5v figure 10. uvlo threshold vs. junction temperature 2.10 2.12 2.14 2.16 2.18 2.2 2.22 2.24 2.26 2.28 2.30 junction temperature (c) threshold (v) rising falling -50 0 50 100 150 -50 0 50 100 150 -50 0 50 100 150 -40 -20 0 20 40 60 80 vin=2.5v vin=3.3v vin=5v vin=5.5v rdson (m)
AOZ1342 rev. 1.5 july 2011 www.aosmd.com page 8 of 12 detailed description the AOZ1342 family of power-distribution switches are intended for applications where heavy capacitive loads and short-circuits are likely to be encountered. this device incorporates 70 m n-channel mosfet power switches for power-distribu tion systems that require multiple power switches in a single package. each switch is controlled by a logic en able input. gate drive is provided by an internal charge pump designed to control the power-switch rise times and fall times to minimize current surges during switching. the charge pump requires no external components and allows operation from supplies as low as 2.7 v. thermal shut-down protection when the output load exceeds the current-limit threshold or a short is present, the device limits the output current to a safe level by switching into a constant-current mode, pulling the overcurrent (o c) logic output low. during current limit or sh ort circuit conditions, the increasing power dissipation in the chip causes the die temperature to rise. when the die temperature reaches a certain level, the thermal sh utdown circuitry will shutdown the device. the thermal shut down will cycle repeatedly until the short circuit condition is resolved. applications information input capacitor selection the input capacitor prevents large voltage transients from appearing at the input, and provides the instantaneous current needed each time the switch turns on and to also limit input voltage drop. the input capacitor also prevents high-frequency noise on the power line from passing through the output of the power side. the choice of input capacitor is based on its ripple current and voltage ratings rather than its capacitor value. the input capacitor should be located as close as possible to the vin pin. a 0.1 f ceramic cap is recommended. however, a hi gher value capacitor will reduce the voltage drop at the input. output capacitor selection the output capacitor acts in a similar way. a small 0.1 f capacitor prevents high-frequency noise from going into the system. also, the output capacitor has to supply enough current for the large load that it may encounter during system transients. this bulk capacitor must be large enough to supply a fast transient load in order to prevent the output from dropping. power dissipation calculation calculate the power dissipation for normal load condition using the following equation: p d = r on x (i out ) 2 the worst case power dissipation occurs when the load current hits the current limit due to over-current or short circuit faults. the power dissipation under these conditions can be calculated using the following equation: p d = (v in ? v out ) x i limit layout guidelines good pcb layout is important for improving the thermal and overall performance of AOZ1342. to optimize the switch response time to out put short-circuit conditions, keep all traces as short as possible to reduce the effect of unwanted parasitic inductance. place the input and output bypass capacitors as close as possible to the in and out pins. the input and output pcb traces should be as wide as possible for the given pcb space. use a ground plane to enhance th e power dissipation capability of the device.
AOZ1342 rev. 1.5 july 2011 www.aosmd.com page 9 of 12 usb power distribut ion application figure 11. typical six-port usb host/s elf-powered hub applications circuitry AOZ1342 in d+ vbus d- out1 out2 gnd power supply cx 0.1 f cx 22 f 0.1 f 10k 10k gnd usb controller d+ vbus d- cx 0.1 f cx 22 f gnd d+ vbus d- cx 0.1 f cx 22 f gnd d+ vbus d- cx 0.1 f cx 22 f gnd d+ vbus d- cx 0.1 f cx 22 f gnd d+ vbus d- cx 0.1 f cx 22 f gnd oc1 en2/en2 oc2 en1/en1
AOZ1342 rev. 1.5 july 2011 www.aosmd.com page 10 of 12 package dimensions, exposed pad so-8 notes: 1. package body sizes exclude mold flash and gate burrs. 2. dimension l is measured in gauge plane. 3. tolerance 0.10mm unless otherwise specified. 4. controlling dimension is millimeter, converted inch dimensions are not necessarily exact. 5. die pad exposure size is according to lead frame design. 6. followed from jedec ms-012 symbols a a1 a2 b c d d0 d1 e e e1 e2 e3 l y | l1Cl1' | l1 dimensions in millimeters recommended land pattern min. 1.40 0.00 1.40 0.31 0.17 4.80 3.20 3.10 5.80 3.80 2.21 0.40 0 d0 unit: mm nom. 1.55 0.05 1.50 0.406 4.96 3.40 3.30 6.00 1.27 3.90 2.41 0.40 ref 0.95 3 0.04 1.04 ref max. 1.70 0.10 1.60 0.51 0.25 5.00 3.60 3.50 6.20 4.00 2.61 1.27 0.10 8 0.12 dimensions in inches d1 e1 e e3 e2 note 5 l1' l1 l gauge plane 0.2500 c d 7 (4x) b 3.70 2.20 2.87 2.71 5.74 1.27 0.80 0.635 e a1 a2 a symbols a a1 a2 b c d d0 d1 e e e1 e2 e3 l y | l1Cl1' | l1 min. 0.055 0.000 0.055 0.012 0.007 0.189 0.126 0.122 0.228 0.150 0.087 0.016 0 nom. 0.061 0.002 0.059 0.016 0.195 0.134 0.130 0.236 0.050 0.153 0.095 0.016 ref 0.037 3 0.002 0.041 ref max. 0.067 0.004 0.063 0.020 0.010 0.197 0.142 0.138 0.244 0.157 0.103 0.050 0.004 8 0.005
AOZ1342 rev. 1.5 july 2011 www.aosmd.com page 11 of 12 tape and reel dimens ions, exposed pad so-8 carrier tape reel tape size 12mm reel size ?330 m ?330.00 0.50 package so-8 (12mm) a0 6.40 0.10 b0 5.20 0.10 k0 2.10 0.10 d0 1.60 0.10 d1 1.50 0.10 e 12.00 0.10 e1 1.75 0.10 e2 5.50 0.10 p0 8.00 0.10 p1 4.00 0.10 p2 2.00 0.10 t 0.25 0.10 n ?97.00 0.10 k0 unit: mm b0 g m w1 s k h n w v r trailer tape 300mm min. or 75 empty pockets components tape orientation in pocket leader tape 500mm min. or 125 empty pockets a0 p1 p2 feeding direction p0 e2 e1 e d0 t d1 w 13.00 0.30 w1 17.40 1.00 h ?13.00 +0.50/-0.20 k 10.60 s 2.00 0.50 g r v leader/trailer and orientation unit: mm
AOZ1342 rev. 1.5 july 2011 www.aosmd.com page 12 of 12 part marking z1342pi fay part number code assembly lot code year & week code wlt fab code & assembly location code AOZ1342pi (exposed pad so-8) z1342pi1 fay part number code assembly lot code year & week code wlt fab code & assembly location code AOZ1342pi-1 (exposed pad so-8) as used herein: 1. life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury of the user. 2. a critical component in any component of a life support, device, or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. this datasheet contains preliminary data; supplementary data may be published at a later date. alpha & omega semiconductor reserves the right to make changes at any time without notice. life support policy alpha & omega semiconductor products ar e not authorized for use as critical components in life support devices or systems.

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